Category:Tao Li of Slingerlands NY (US): Difference between revisions

Tao Li of Slingerlands NY (US)

Executive Summary

Tao Li of Slingerlands NY (US) is an inventor who has filed 20 patents. Their primary areas of innovation include No explanation available (11 patents), No explanation available (10 patents), No explanation available (9 patents), and they have worked with companies such as INTERNATIONAL BUSINESS MACHINES CORPORATION (11 patents), International Business Machines Corporation (9 patents). Their most frequent collaborators include (20 collaborations), (6 collaborations), (5 collaborations).

Patent Filing Activity

File:Tao Li of Slingerlands NY (US) Monthly Patent Applications.png

Technology Areas

File:Tao Li of Slingerlands NY (US) Top Technology Areas.png

List of Technology Areas

• H10D30/6735 (No explanation available): 11 patents
• H10D62/121 (No explanation available): 10 patents
• H10D30/43 (No explanation available): 9 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 7 patents
• H10D30/6757 (No explanation available): 7 patents
• H10D30/014 (No explanation available): 6 patents
• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H10D30/6729 (No explanation available): 5 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H10D62/151 (No explanation available): 4 patents
• H10D84/038 (No explanation available): 4 patents
• H10D84/85 (No explanation available): 4 patents
• H01L29/41766 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/76224 ({using trench refilling with dielectric materials (trench filling with polycristalline silicon): 2 patents
• H01L29/66545 ({using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate}): 2 patents
• H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L29/78696 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 2 patents
• H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L27/124 (the substrate being other than a semiconductor body, e.g. an insulating body): 2 patents
• H01L27/1266 (the substrate being other than a semiconductor body, e.g. an insulating body): 2 patents
• H10D64/017 (No explanation available): 2 patents
• H10D84/017 (No explanation available): 2 patents
• H10D64/01 (No explanation available): 2 patents
• H10D84/83 (No explanation available): 2 patents
• H10B10/12 (ELECTRONIC MEMORY DEVICES): 1 patents
• H01L21/823807 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823871 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823885 ({with a particular manufacturing method of vertical transistor structures, i.e. with channel vertical to the substrate surface (with a current flow parallel to the substrate surface): 1 patents
• H01L27/092 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/66666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/7827 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76831 ({in via holes or trenches, e.g. non-conductive sidewall liners}): 1 patents
• H01L21/76885 ({By forming conductive members before deposition of protective insulating material, e.g. pillars, studs}): 1 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0924 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0928 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823437 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823418 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/76897 ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step (self-aligned silicidation on field effect transistors): 1 patents
• H10D84/013 (No explanation available): 1 patents
• H10D84/0149 (No explanation available): 1 patents
• H10D84/0128 (No explanation available): 1 patents
• H10D30/6748 (No explanation available): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L27/1255 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
• H01L27/127 (the substrate being other than a semiconductor body, e.g. an insulating body): 1 patents
• H10D84/0179 (No explanation available): 1 patents
• H01L21/02532 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02609 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D64/256 (No explanation available): 1 patents
• H01L29/41775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L29/0669 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10D64/258 (No explanation available): 1 patents
• H10D84/853 (No explanation available): 1 patents
• H10D30/024 (No explanation available): 1 patents
• H10D30/62 (No explanation available): 1 patents
• H10D62/154 (No explanation available): 1 patents
• H10D62/158 (No explanation available): 1 patents
• H10D84/0151 (No explanation available): 1 patents
• H10D84/0158 (No explanation available): 1 patents
• H10D84/834 (No explanation available): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents

Companies

File:Tao Li of Slingerlands NY (US) Top Companies.png

List of Companies

• INTERNATIONAL BUSINESS MACHINES CORPORATION: 11 patents
• International Business Machines Corporation: 9 patents

Collaborators

• Ruilong Xie of Niskayuna NY (US) (20 collaborations)
• Tsung-Sheng Kang of Ballston Lake NY (US) (6 collaborations)
• Nicolas Jean Loubet of GUILDERLAND NY (US) (5 collaborations)
• Julien Frougier of Albany NY (US) (4 collaborations)
• Chanro Park of Clifton Park NY (US) (3 collaborations)
• Juntao Li of Cohoes NY (US) (3 collaborations)
• Kisik Choi of Watervliet NY (US) (3 collaborations)
• Lijuan Zou of Slingerlands NY (US) (3 collaborations)
• Min Gyu Sung of Latham NY (US) (2 collaborations)
• Nicholas Alexander Polomoff of Hopewell Junction NY (US) (2 collaborations)
• Nicholas Anthony Lanzillo of Wynantskill NY (US) (1 collaborations)
• Koichi Motoyama of Clifton Park NY (US) (1 collaborations)
• John Christopher Arnold of North Chatham NY (US) (1 collaborations)
• Huimei Zhou of Albany NY (US) (1 collaborations)
• FENG LIU of Niskayuna NY (US) (1 collaborations)
• Anthony I. Chou of Guilderland NY (US) (1 collaborations)
• Susan Ng Emans of Albany NY (US) (1 collaborations)
• Albert M. Chu of Nashua NH (US) (1 collaborations)
• Nicolas Jean Loubet of Guilderland NY (US) (1 collaborations)
• Sagarika Mukesh of Albany NY (US) (1 collaborations)
• Alexander Reznicek of Troy NY (US) (1 collaborations)
• Joshua M. Rubin of Albany NY (US) (1 collaborations)
• Shay Reboh of Albany NY (US) (1 collaborations)
• Shogo Mochizuki of Mechanicville NY (US) (1 collaborations)
• Shay Reboh of Guilderland NY (US) (1 collaborations)
• Jingyun Zhang of Albany NY (US) (1 collaborations)