Category:Nicholas Anthony Lanzillo of Wynantskill NY (US)

Nicholas Anthony Lanzillo of Wynantskill NY (US)

Executive Summary

Nicholas Anthony Lanzillo of Wynantskill NY (US) is an inventor who has filed 12 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), {Geometry or} layout of the interconnection structure {( (4 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as INTERNATIONAL BUSINESS MACHINES CORPORATION (8 patents), International Business Machines Corporation (4 patents). Their most frequent collaborators include (10 collaborations), (5 collaborations), (5 collaborations).

Patent Filing Activity

File:Nicholas Anthony Lanzillo of Wynantskill NY (US) Monthly Patent Applications.png

Technology Areas

File:Nicholas Anthony Lanzillo of Wynantskill NY (US) Top Technology Areas.png

List of Technology Areas

• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 4 patents
• H01L29/0673 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/42392 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L29/775 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 2 patents
• H01L29/66439 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/76897 ({Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step (self-aligned silicidation on field effect transistors): 2 patents
• H10D30/43 (No explanation available): 2 patents
• H10D30/6735 (No explanation available): 2 patents
• H10D62/121 (No explanation available): 2 patents
• H01L21/76886 ({Modifying permanently or temporarily the pattern or the conductivity of conductive members, e.g. formation of alloys, reduction of contact resistances}): 1 patents
• H01L21/768 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76831 ({in via holes or trenches, e.g. non-conductive sidewall liners}): 1 patents
• H01L21/76885 ({By forming conductive members before deposition of protective insulating material, e.g. pillars, studs}): 1 patents
• H01L29/41733 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L29/0847 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/3065 (Plasma etching; Reactive-ion etching): 1 patents
• H01L21/76816 ({Aspects relating to the layout of the pattern or to the size of vias or trenches (layout of the interconnections per se): 1 patents
• H01L23/5256 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H10D30/6757 (No explanation available): 1 patents
• H10D64/251 (No explanation available): 1 patents
• H10D84/83 (No explanation available): 1 patents
• H01L21/7682 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76838 ({characterised by the formation and the after-treatment of the conductors (etching for patterning the conductors): 1 patents
• H01L29/41766 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/823475 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/823481 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L27/088 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/0928 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H10D30/014 (No explanation available): 1 patents
• H10D30/6729 (No explanation available): 1 patents
• H10D64/017 (No explanation available): 1 patents
• H10D84/0167 (No explanation available): 1 patents
• H10D84/017 (No explanation available): 1 patents
• H10D84/0186 (No explanation available): 1 patents
• H10D84/038 (No explanation available): 1 patents
• H10D84/856 (No explanation available): 1 patents
• H10D88/01 (No explanation available): 1 patents

Companies

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List of Companies

• INTERNATIONAL BUSINESS MACHINES CORPORATION: 8 patents
• International Business Machines Corporation: 4 patents

Collaborators

• Ruilong Xie of Niskayuna NY (US) (10 collaborations)
• Lawrence A. Clevenger of Saratoga Springs NY (US) (5 collaborations)
• Reinaldo Vega of Mahopac NY (US) (5 collaborations)
• Koichi Motoyama of Clifton Park NY (US) (4 collaborations)
• Brent A. Anderson of Jericho VT (US) (4 collaborations)
• Albert M. Chu of Nashua NH (US) (4 collaborations)
• James P. Mazza of Saratoga Springs NY (US) (4 collaborations)
• Takashi Ando of Eastchester NY (US) (3 collaborations)
• David Wolpert of Poughkeepsie NY (US) (3 collaborations)
• Chih-Chao Yang of Glenmont NY (US) (1 collaborations)
• Tao Li of Slingerlands NY (US) (1 collaborations)
• Dan Moy of Bethel CT (US) (1 collaborations)
• JENS HAETTY of Halfmoon NY (US) (1 collaborations)
• Christopher Murphy of Red Hook NY (US) (1 collaborations)
• Huai Huang of Clifton Park NY (US) (1 collaborations)
• Hosadurga Shobha of Niskayuna NY (US) (1 collaborations)
• Atharv Jog of Albany NY (US) (1 collaborations)
• Shahrukh Khan of Sandy Hook CT (US) (1 collaborations)
• Biswanath Senapati of Mechanicville NY (US) (1 collaborations)
• Utkarsh Bajpai of Delmar NY (US) (1 collaborations)
• Tenko Yamashita of Schenectady NY (US) (1 collaborations)
• John Christopher Arnold of North Chatham NY (US) (1 collaborations)
• Chen Zhang of Santa Clara CA (US) (1 collaborations)
• Terence B. Hook of Jericho Center VT (US) (1 collaborations)
• Junli Wang of Slingerlands NY (US) (1 collaborations)