Category:Hosadurga Shobha of Niskayuna NY (US)

Hosadurga Shobha of Niskayuna NY (US)

Executive Summary

Hosadurga Shobha of Niskayuna NY (US) is an inventor who has filed 1 patents. Their primary areas of innovation include {by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating (plating on semiconductors in general (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), {formation of thin insulating films on the sidewalls or on top of conductors ( (1 patents), and they have worked with companies such as Adeia Semiconductor Solutions LLC (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Hosadurga Shobha of Niskayuna NY (US) Monthly Patent Applications.png

Technology Areas

File:Hosadurga Shobha of Niskayuna NY (US) Top Technology Areas.png

List of Technology Areas

• H01L21/76879 ({by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating (plating on semiconductors in general): 1 patents
• H01L2924/0002 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76834 ({formation of thin insulating films on the sidewalls or on top of conductors (): 1 patents
• H01L21/76831 ({in via holes or trenches, e.g. non-conductive sidewall liners}): 1 patents
• H01L21/76855 ({After-treatment introducing at least one additional element into the layer}): 1 patents
• H01L21/02068 ({during, before or after processing of insulating layers}): 1 patents
• H01L23/528 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L23/53238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/7684 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
• H01L21/76843 ({formed in openings in a dielectric}): 1 patents
• H01L21/76858 ({by diffusing alloying elements}): 1 patents
• H01L21/76865 ({Selective removal of parts of the layer (): 1 patents
• H01L21/76873 ({Thin films associated with contacts of capacitors}): 1 patents
• H01L21/76888 ({by deposition over sacrificial masking layer, e.g. lift-off (lift-off per se): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/02172 ({the material containing at least one metal element, e.g. metal oxides, metal nitrides, metal oxynitrides or metal carbides (materials containing silicon): 1 patents
• H01L21/02244 ({the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides (adhesion layers or buffer layers): 1 patents
• H01L21/76846 ({Layer combinations}): 1 patents
• H01L21/7685 ({the layer covering a conductive structure (): 1 patents
• H01L21/76856 ({by treatment in plasmas or gaseous environments, e.g. nitriding a refractory metal liner}): 1 patents
• H01L21/76849 ({the layer being positioned on top of the main fill metal}): 1 patents

Companies

File:Hosadurga Shobha of Niskayuna NY (US) Top Companies.png

List of Companies

• Adeia Semiconductor Solutions LLC: 1 patents

Collaborators

• Daniel C. Edelstein of White Plains NY (US) (1 collaborations)
• Son V. Nguyen of Schenectady NY (US) (1 collaborations)
• Takeshi Nogami of Schenectady NY (US) (1 collaborations)
• Deepika Priyadarshini of Guilderland NY (US) (1 collaborations)