Category:Michael B. Vincent of Chandler AZ (US)

Michael B. Vincent of Chandler AZ (US)

Executive Summary

Michael B. Vincent of Chandler AZ (US) is an inventor who has filed 6 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (5 patents), the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ (4 patents), Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups (3 patents), and they have worked with companies such as NXP USA, Inc. (4 patents), NXP USA, INC. (2 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (3 collaborations).

Patent Filing Activity

File:Michael B. Vincent of Chandler AZ (US) Monthly Patent Applications.png

Technology Areas

File:Michael B. Vincent of Chandler AZ (US) Top Technology Areas.png

List of Technology Areas

• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 4 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 3 patents
• H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/5383 ({Multilayer substrates (): 3 patents
• H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
• H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 2 patents
• H01L21/566 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 2 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 2 patents
• H01L25/165 (the devices being of types provided for in two or more different main groups of groups): 2 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/351 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/162 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/19043 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L28/10 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01F41/043 (for manufacturing coils {(coils for transformer or inductances): 1 patents
• H01F41/127 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites): 1 patents
• H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/52 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01F27/2804 (MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES (ceramics based on ferrites): 1 patents
• H01L23/3185 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B29C45/14639 ({for obtaining an insulating effect, e.g. for electrical components}): 1 patents
• H01L23/3192 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L31/0203 (Containers; Encapsulations {, e.g. encapsulation of photodiodes} (for photovoltaic devices): 1 patents
• B29K2063/00 (INDEXING SCHEME ASSOCIATED WITH SUBCLASSES): 1 patents
• H01L23/66 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H01P3/06 (Coaxial lines): 1 patents
• H01P11/005 (Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type): 1 patents
• H01Q1/2283 ({mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package}): 1 patents
• H01Q9/0407 ({Substantially flat resonant element parallel to ground plane, e.g. patch antenna (dipole): 1 patents
• H01L2223/6622 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2223/6677 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• NXP USA, Inc.: 4 patents
• NXP USA, INC.: 2 patents

Collaborators

• Scott M. Hayes of Chandler AZ (US) (3 collaborations)
• Antonius Hendrikus Jozef Kamphuis (3 collaborations)
• Zhiwei Gong of Chandler AZ (US) (3 collaborations)
• Leo van Gemert (3 collaborations)
• Wen Hung Huang (2 collaborations)
• Wen Hung Huang of Chandler AZ (US) (1 collaborations)
• Scott M Hayes of Chandler AZ (US) (1 collaborations)
• Varughese Mathew of Austin TX (US) (1 collaborations)
• Ankur Shah of Chandler AZ (US) (1 collaborations)