Category:Kazuyuki MITSUKURA

Kazuyuki MITSUKURA

Executive Summary

Kazuyuki MITSUKURA is an inventor who has filed 5 patents. Their primary areas of innovation include Printed circuits structurally associated with non-printed electric components ({ (2 patents), {by electroless plating (adhesives therefor (2 patents), {Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates} (2 patents), and they have worked with companies such as Resonac Corporation (4 patents), RESONAC CORPORATION (1 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (1 collaborations).

Patent Filing Activity

File:Kazuyuki MITSUKURA Monthly Patent Applications.png

Technology Areas

File:Kazuyuki MITSUKURA Top Technology Areas.png

List of Technology Areas

• H05K1/181 (Printed circuits structurally associated with non-printed electric components ({): 2 patents
• H05K3/181 ({by electroless plating (adhesives therefor): 2 patents
• H05K3/022 ({Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates}): 2 patents
• H05K3/1208 (using {thick film techniques, e.g.} printing techniques to apply the conductive material {or similar techniques for applying conductive paste or ink patterns}): 1 patents
• H05K3/107 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K3/025 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L21/4846 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 1 patents
• H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H05K2201/10553 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0358 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2203/1377 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents
• H05K2201/0209 (PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS): 1 patents

Companies

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List of Companies

• Resonac Corporation: 4 patents
• RESONAC CORPORATION: 1 patents

Collaborators

• Masaya TOBA (4 collaborations)
• Masaki YAMAGUCHI (3 collaborations)
• Kei TOGASAKI (1 collaborations)
• Kenichi IWASHITA (1 collaborations)
• Keishi ONO (1 collaborations)
• Mao NARITA (1 collaborations)
• Shunsuke OTAKE (1 collaborations)
• Hiroaki FUJITA (1 collaborations)
• Shinji SHIMAOKA (1 collaborations)
• Takashi MASUKO (1 collaborations)
• Kazuhiko KURAFUCHI (1 collaborations)