Category:Hiroaki MATSUBARA

Hiroaki MATSUBARA

Executive Summary

Hiroaki MATSUBARA is an inventor who has filed 7 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (6 patents), Lead-frames {or other flat leads ( (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as ROHM CO., LTD. (7 patents). Their most frequent collaborators include (7 collaborations), (5 collaborations), (5 collaborations).

Patent Filing Activity

File:Hiroaki MATSUBARA Monthly Patent Applications.png

Technology Areas

File:Hiroaki MATSUBARA Top Technology Areas.png

List of Technology Areas

• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 3 patents
• H01L24/45 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49562 (Lead-frames {or other flat leads (): 2 patents
• H01L23/49503 (Lead-frames {or other flat leads (): 2 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/48247 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/13091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2924/19042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/49555 (Lead-frames {or other flat leads (): 2 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 2 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/48245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/45144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 2 patents
• H01L23/49537 (Lead-frames {or other flat leads (): 1 patents
• H01L23/645 ({Inductive arrangements (): 1 patents
• H01L23/295 ({containing a filler (): 1 patents
• H01L24/49 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L31/02005 ({for device characterised by at least one potential jump barrier or surface barrier}): 1 patents
• H01L31/0203 (Containers; Encapsulations {, e.g. encapsulation of photodiodes} (for photovoltaic devices): 1 patents
• H01L33/56 (Materials, e.g. epoxy or silicone resin): 1 patents
• H01L33/62 (Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls): 1 patents
• H01L31/18 (Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof): 1 patents
• H01L2933/005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2933/0066 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49513 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49517 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49558 (Lead-frames {or other flat leads (): 1 patents
• H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/29139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49579 (Lead-frames {or other flat leads (): 1 patents
• H01L24/46 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/45147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/45664 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/46 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48195 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48991 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48455 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3512 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Hiroaki MATSUBARA Top Companies.png

List of Companies

• ROHM CO., LTD.: 7 patents

Collaborators

• Yoshizo OSUMI (7 collaborations)
• Tomohira KIKUCHI (5 collaborations)
• Taro NISHIOKA (5 collaborations)
• Ryohei UMENO (4 collaborations)
• Moe YAMAGUCHI (4 collaborations)