Category:Gang Duan of Chandler AZ (US)

Gang Duan of Chandler AZ (US)

Executive Summary

Gang Duan of Chandler AZ (US) is an inventor who has filed 17 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (11 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (7 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (7 patents), and they have worked with companies such as Intel Corporation (17 patents). Their most frequent collaborators include (11 collaborations), (8 collaborations), (6 collaborations).

Patent Filing Activity

File:Gang Duan of Chandler AZ (US) Monthly Patent Applications.png

Technology Areas

File:Gang Duan of Chandler AZ (US) Top Technology Areas.png

List of Technology Areas

• H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 11 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 7 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 6 patents
• H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 5 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
• H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
• H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
• H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/5383 ({Multilayer substrates (): 2 patents
• H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/1703 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/645 ({Inductive arrangements (): 2 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 2 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L23/24 (solid or gel at the normal operating temperature of the device {(): 1 patents
• H01L23/3675 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/24 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/24226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L28/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/49866 ({characterised by the materials (materials of the substrates): 1 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/585 ({comprising conductive layers or plates or strips or rods or rings (): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
• H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05611 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80411 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80447 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/642 ({Capacitive arrangements (): 1 patents
• H01L23/535 (including internal interconnections, e.g. cross-under constructions {(internal lead connections): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/117 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H01L29/66181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32157 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1205 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0345 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03452 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0347 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05073 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05558 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05573 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05644 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05664 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L27/156 (including semiconductor components having potential barriers, specially adapted for light emission): 1 patents
• H01L23/4821 (consisting of lead-in layers inseparably applied to the semiconductor body {(electrodes): 1 patents
• H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1435 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16238 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents

Companies

File:Gang Duan of Chandler AZ (US) Top Companies.png

List of Companies

• Intel Corporation: 17 patents

Collaborators

• Srinivas Venkata Ramanuja Pietambaram of Chandler AZ (US) (11 collaborations)
• Minglu Liu of Chandler AZ (US) (8 collaborations)
• Jeremy Ecton of Gilbert AZ (US) (6 collaborations)
• Brandon C. Marin of Gilbert AZ (US) (4 collaborations)
• Srinivas V. Pietambaram of Chandler AZ (US) (4 collaborations)
• Bohan Shan of Chandler AZ (US) (3 collaborations)
• Brandon Christian Marin of Gilbert AZ (US) (2 collaborations)
• Haobo Chen of Chandler AZ (US) (2 collaborations)
• Jung Kyu Han of Chandler AZ (US) (2 collaborations)
• Suddhasattwa Nad of Chandler AZ (US) (2 collaborations)
• Tarek A. Ibrahim of Mesa AZ (US) (2 collaborations)
• Ibrahim El Khatib of Chandler AZ (US) (1 collaborations)
• Jesse Cole Jones of Chandler AZ (US) (1 collaborations)
• Yi Li of Chandler AZ (US) (1 collaborations)
• Robin Shea McRee of Chandler AZ (US) (1 collaborations)
• Praveen Sreeramagiri of Gilbert AZ (US) (1 collaborations)
• Xiao Liu of Chandler AZ (US) (1 collaborations)
• Dingying Xu of Chandler AZ (US) (1 collaborations)
• Hongxia Feng of Chandler AZ (US) (1 collaborations)
• Xiaoying Guo of Chandler AZ (US) (1 collaborations)
• Zhixin Xie of Chandler AZ (US) (1 collaborations)
• Xiyu Hu of Chandler AZ (US) (1 collaborations)
• Robert Alan May of Chandler AZ (US) (1 collaborations)
• Kristof Kuwawi Darmawikarta of Chandler AZ (US) (1 collaborations)
• Changhua Liu of Chandler AZ (US) (1 collaborations)
• Yosuke Kanaoka (1 collaborations)
• Marcel Arlan Wall of Phoenix AZ (US) (1 collaborations)
• Hamid Azimi of Chandler AZ (US) (1 collaborations)
• Rahul N. Manepalli of Chandler AZ (US) (1 collaborations)
• Darko Grujicic of Chandler AZ (US) (1 collaborations)
• Steve Cho of Chandler AZ (US) (1 collaborations)
• Thomas L. Sounart of Chandler AZ (US) (1 collaborations)
• Benjamin Duong of Phoenix AZ (US) (1 collaborations)
• Shayan Kaviani of Phoenix AZ (US) (1 collaborations)
• Hiroki Tanaka of Gilbert AZ (US) (1 collaborations)
• Jason Gamba of Gilbert AZ (US) (1 collaborations)
• Robert May of Chandler AZ (US) (1 collaborations)
• Benjamin Taylor Duong of Phoenix AZ (US) (1 collaborations)
• Bai Nie of Chandler AZ (US) (1 collaborations)
• Whitney Bryks of Tempe AZ (US) (1 collaborations)
• Brandon Marin of Gilbert AZ (US) (1 collaborations)
• Khaled Ahmed of San Jose CA (US) (1 collaborations)
• Srinivas Pietambaram of Chandler AZ (US) (1 collaborations)
• Benjamin T. Duong of Phoenix AZ (US) (1 collaborations)