Category:CHUNG-HO WEI
CHUNG-HO WEI
Executive Summary
CHUNG-HO WEI is an inventor who has filed 2 patents. Their primary areas of innovation include SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (2 patents), Soldering, e.g. brazing, or unsoldering ( (1 patents), characterised by mechanical features, e.g. shape (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).
Patent Filing Activity
File:CHUNG-HO WEI Monthly Patent Applications.png
Technology Areas
File:CHUNG-HO WEI Top Technology Areas.png
List of Technology Areas
- B23K35/3006 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
- B23K1/0016 (Soldering, e.g. brazing, or unsoldering (): 1 patents
- B23K35/025 (characterised by mechanical features, e.g. shape): 1 patents
- B23K35/302 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
- B32B15/04 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
- B23K2101/36 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
- B23K2103/52 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
- B32B2311/08 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
- B32B2311/12 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
- H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
- B23K35/0238 (characterised by mechanical features, e.g. shape): 1 patents
- B23K35/286 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
Companies
File:CHUNG-HO WEI Top Companies.png
List of Companies
- TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents
Collaborators
- CHIH-WEI MAO (2 collaborations)
- TSUNG-YING CHANG (2 collaborations)
- MING-YI HSU (2 collaborations)
- CHI-WEN HUANG (2 collaborations)
Subcategories
This category has the following 5 subcategories, out of 5 total.