Category:MING-YI HSU

MING-YI HSU

Executive Summary

MING-YI HSU is an inventor who has filed 2 patents. Their primary areas of innovation include SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (2 patents), Soldering, e.g. brazing, or unsoldering ( (1 patents), characterised by mechanical features, e.g. shape (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include (2 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• B23K35/3006 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
• B23K1/0016 (Soldering, e.g. brazing, or unsoldering (): 1 patents
• B23K35/025 (characterised by mechanical features, e.g. shape): 1 patents
• B23K35/302 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B32B15/04 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B23K2101/36 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B23K2103/52 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• B32B2311/08 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B2311/12 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B23K35/0238 (characterised by mechanical features, e.g. shape): 1 patents
• B23K35/286 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents

Companies

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List of Companies

• TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents

Collaborators

• CHIH-WEI MAO (2 collaborations)
• TSUNG-YING CHANG (2 collaborations)
• CHUNG-HO WEI (2 collaborations)
• CHI-WEN HUANG (2 collaborations)