Category:Chang Chi LEE

Chang Chi LEE

Executive Summary

Chang Chi LEE is an inventor who has filed 4 patents. Their primary areas of innovation include {Multilayer substrates (multilayer metallisation on monolayer substrate (1 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Advanced Semiconductor Engineering, Inc. (4 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Chang Chi LEE Monthly Patent Applications.png

Technology Areas

File:Chang Chi LEE Top Technology Areas.png

List of Technology Areas

• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L23/5387 ({Flexible insulating substrates (): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73257 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/16 (the devices being of types provided for in two or more different main groups of groups): 1 patents
• H01L28/10 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L28/40 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Advanced Semiconductor Engineering, Inc.: 4 patents

Collaborators

• Jung Jui KANG (3 collaborations)
• Chun-Yen TING (2 collaborations)
• Hung-Chun KUO (2 collaborations)
• Chiung-Ying KUO (1 collaborations)
• Chiu-Wen LEE (1 collaborations)
• Li Chieh CHEN (1 collaborations)
• Pao-Nan LEE (1 collaborations)
• Chen-Chao WANG (1 collaborations)