Category:Hung-Chun KUO

Hung-Chun KUO

Executive Summary

Hung-Chun KUO is an inventor who has filed 4 patents. Their primary areas of innovation include the devices being of types provided for in two or more different subgroups of the same main group of groups (2 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (1 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (1 patents), and they have worked with companies such as Advanced Semiconductor Engineering, Inc. (4 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

File:Hung-Chun KUO Monthly Patent Applications.png

Technology Areas

File:Hung-Chun KUO Top Technology Areas.png

List of Technology Areas

• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 2 patents
• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H05K1/0231 ({using auxiliary mounted passive components or auxiliary substances (printed passive components): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73257 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
• H01L23/49568 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49575 (Lead-frames {or other flat leads (): 1 patents
• H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Hung-Chun KUO Top Companies.png

List of Companies

• Advanced Semiconductor Engineering, Inc.: 4 patents

Collaborators

• Chun-Yen TING (3 collaborations)
• Jung Jui KANG (3 collaborations)
• Chiung-Ying KUO (2 collaborations)
• Chang Chi LEE (2 collaborations)
• Po-Chih PAN (1 collaborations)