Category:Guilian Gao of Campbell CA (US)

Guilian Gao of Campbell CA (US)

Executive Summary

Guilian Gao of Campbell CA (US) is an inventor who has filed 3 patents. Their primary areas of innovation include {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Guilian Gao of Campbell CA (US) Monthly Patent Applications.png

Technology Areas

File:Guilian Gao of Campbell CA (US) Top Technology Areas.png

List of Technology Areas

• H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 3 patents
• H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
• H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/0219 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/03011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05618 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
• H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Guilian Gao of Campbell CA (US) Top Companies.png

List of Companies

• ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 3 patents

Collaborators

• Laura Wills Mirkarimi of Sunol CA (US) (3 collaborations)
• Cyprian Emeka Uzoh of San Jose CA (US) (2 collaborations)
• Gaius Gillman Fountain, JR. of Youngsville NC (US) (2 collaborations)
• Jeremy Alfred Theil of Mountain View CA (US) (1 collaborations)
• Belgacem Haba of Saratoga CA (US) (1 collaborations)
• Thomas Workman of San Jose CA (US) (1 collaborations)
• Pawel Mrozek of San Jose CA (US) (1 collaborations)
• Ron Zhang of Sunnyvale CA (US) (1 collaborations)