Category:Hayato IGA

Hayato IGA

Executive Summary

Hayato IGA is an inventor who has filed 9 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (6 patents), {Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses (6 patents), {Edge treatment, chamfering} (3 patents), and they have worked with companies such as DISCO CORPORATION (9 patents). Their most frequent collaborators include (7 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 6 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 6 patents
• H01L21/02021 ({Edge treatment, chamfering}): 3 patents
• B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 3 patents
• H01L21/268 (Bombardment with radiation {(): 2 patents
• H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
• H01L2221/68327 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L22/20 ({Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps}): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• B32B38/0004 (Ancillary operations in connection with laminating processes): 1 patents
• B32B38/0012 (Ancillary operations in connection with laminating processes): 1 patents
• B32B41/00 (Arrangements for controlling or monitoring lamination processes; Safety arrangements): 1 patents
• H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
• B32B2038/0016 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B2310/0843 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B26D5/007 (Arrangements for operating and controlling machines or devices for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting): 1 patents
• B26D1/04 (having a linearly-movable cutting member (): 1 patents
• G01N21/9505 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms): 1 patents
• B23K26/083 (Devices involving relative movement between laser beam and workpiece): 1 patents
• B23K26/0869 (Devices involving relative movement between laser beam and workpiece): 1 patents
• G01N21/17 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms): 1 patents
• G01N21/8806 ({Specially adapted optical and illumination features}): 1 patents
• B23K2103/56 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• G01N2021/1736 (INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing processes other than immunoassay, involving enzymes or microorganisms): 1 patents
• B23K26/364 (Removing material (): 1 patents
• H01L21/67155 ({Apparatus for applying a liquid, a resin, an ink or the like (): 1 patents
• H01L21/67242 ({Apparatus for monitoring, sorting or marking (testing or measuring during manufacture): 1 patents
• H01L21/02016 ({Backside treatment}): 1 patents
• H01L21/68764 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents

Companies

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List of Companies

• DISCO CORPORATION: 9 patents

Collaborators

• Kazuya HIRATA (7 collaborations)
• Yuichi KITAZUMI (1 collaborations)
• KwangYoung JUNG (1 collaborations)
• Kentaro IIZUKA (1 collaborations)
• Hironobu OZAWA (1 collaborations)
• Mato HATTORI (1 collaborations)
• Hideo IWATA (1 collaborations)
• Kazuma SEKIYA (1 collaborations)