Category:Kazuma SEKIYA

Kazuma SEKIYA

Executive Summary

Kazuma SEKIYA is an inventor who has filed 3 patents. Their primary areas of innovation include Mechanical treatment, e.g. grinding, polishing, cutting {( (3 patents), SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal (2 patents), to produce devices, e.g. integrated circuits, each consisting of a plurality of components (1 patents), and they have worked with companies such as DISCO CORPORATION (3 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01L21/304 (Mechanical treatment, e.g. grinding, polishing, cutting {(): 3 patents
• B23K26/53 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 2 patents
• H01L21/8213 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• H01L21/822 (to produce devices, e.g. integrated circuits, each consisting of a plurality of components): 1 patents
• B23K2101/40 (SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM (making metal-coated products by extruding metal): 1 patents
• H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
• H01L21/67092 ({Apparatus for mechanical treatment (or grinding or cutting, see the relevant groups in subclasses): 1 patents

Companies

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List of Companies

• DISCO CORPORATION: 3 patents

Collaborators

• Kazuya HIRATA (1 collaborations)
• Hayato IGA (1 collaborations)