Category:JIA-YI WU

JIA-YI WU

Executive Summary

JIA-YI WU is an inventor who has filed 2 patents. Their primary areas of innovation include Layered products comprising a {layer of a} particular substance not covered by groups (1 patents), for securing layers together; for attaching the product to another member, e.g. to a support {, or to another product, e.g. groove/tongue, interlocking} (1 patents), characterised by a discontinuous layer, i.e. formed of separate pieces of material (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• B32B9/005 (Layered products comprising a {layer of a} particular substance not covered by groups): 1 patents
• B32B3/06 (for securing layers together; for attaching the product to another member, e.g. to a support {, or to another product, e.g. groove/tongue, interlocking}): 1 patents
• B32B3/10 (characterised by a discontinuous layer, i.e. formed of separate pieces of material): 1 patents
• B32B15/043 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B15/20 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B38/0012 (Ancillary operations in connection with laminating processes): 1 patents
• B32B38/162 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B2307/538 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B2310/14 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• H01L23/15 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/36 (Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks {(): 1 patents
• H01L23/49805 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 1 patents
• H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08258 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/32112 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents

Collaborators

• YAN-WEI CHEN (1 collaborations)
• HUNG-HSIANG YEH (1 collaborations)