Category:YAN-WEI CHEN

YAN-WEI CHEN

Executive Summary

YAN-WEI CHEN is an inventor who has filed 2 patents. Their primary areas of innovation include Layered products comprising a {layer of a} particular substance not covered by groups (1 patents), for securing layers together; for attaching the product to another member, e.g. to a support {, or to another product, e.g. groove/tongue, interlocking} (1 patents), characterised by a discontinuous layer, i.e. formed of separate pieces of material (1 patents), and they have worked with companies such as TONG HSING ELECTRONIC INDUSTRIES, LTD. (2 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations).

Patent Filing Activity

File:YAN-WEI CHEN Monthly Patent Applications.png

Technology Areas

File:YAN-WEI CHEN Top Technology Areas.png

List of Technology Areas

• B32B9/005 (Layered products comprising a {layer of a} particular substance not covered by groups): 1 patents
• B32B3/06 (for securing layers together; for attaching the product to another member, e.g. to a support {, or to another product, e.g. groove/tongue, interlocking}): 1 patents
• B32B3/10 (characterised by a discontinuous layer, i.e. formed of separate pieces of material): 1 patents
• B32B15/043 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B15/20 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B38/0012 (Ancillary operations in connection with laminating processes): 1 patents
• B32B38/162 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B2307/538 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• B32B2310/14 (LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM): 1 patents
• H01L23/4951 (Lead-frames {or other flat leads (): 1 patents
• H01L23/4952 (Lead-frames {or other flat leads (): 1 patents
• H01L23/49568 (Lead-frames {or other flat leads (): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2225/06517 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• TONG HSING ELECTRONIC INDUSTRIES, LTD.: 2 patents

Collaborators

• JIA-YI WU (1 collaborations)
• CHIH-JEN SU (1 collaborations)