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=== Executive Summary ===
=== Executive Summary ===
Guilian Gao of Campbell CA (US) is an inventor who has filed 4 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (2 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3 patents), Adeia Semiconductor Bonding Technologies Inc. (1 patents). Their most frequent collaborators include [[Category:Belgacem Haba of Saratoga CA (US)|Belgacem Haba of Saratoga CA (US)]] (2 collaborations), [[Category:Jeremy Alfred Theil of Mountain View CA (US)|Jeremy Alfred Theil of Mountain View CA (US)]] (2 collaborations), [[Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]] (2 collaborations).
Guilian Gao of Campbell CA (US) is an inventor who has filed 3 patents. Their primary areas of innovation include {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3 patents). Their most frequent collaborators include [[Category:Laura Wills Mirkarimi of Sunol CA (US)|Laura Wills Mirkarimi of Sunol CA (US)]] (3 collaborations), [[Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]] (2 collaborations), [[Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)|Gaius Gillman Fountain, JR. of Youngsville NC (US)]] (2 collaborations).


=== Patent Filing Activity ===
=== Patent Filing Activity ===
Line 11: Line 11:


==== List of Technology Areas ====
==== List of Technology Areas ====
* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 3 patents
* [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
* [[:Category:CPC_H01L24/08|H01L24/08]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/08145|H01L2224/08145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
* [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/46|H01L23/46]] (involving the transfer of heat by flowing fluids  (): 1 patents
* [[:Category:CPC_H01L23/053|H01L23/053]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/38|H01L23/38]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/08245|H01L2224/08245]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/83|H01L24/83]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/6836|H01L21/6836]] ({Wafer tapes, e.g. grinding or dicing support tapes  (adhesive tapes in general): 1 patents
* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
* [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/33|H01L24/33]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/98|H01L24/98]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68327|H01L2221/68327]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68368|H01L2221/68368]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2221/68381|H01L2221/68381]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/03002|H01L2224/03002]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/09181|H01L2224/09181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/32145|H01L2224/32145]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/33181|H01L2224/33181]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/83009|H01L2224/83009]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/83896|H01L2224/83896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/83948|H01L2224/83948]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 1 patents
* [[:Category:CPC_H01L2224/0219|H01L2224/0219]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/03462|H01L2224/03462]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/03011|H01L2224/03011]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/03616|H01L2224/03616]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05618|H01L2224/05618]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05147|H01L2224/05147]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05647|H01L2224/05647]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05657|H01L2224/05657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/3512|H01L2924/3512]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/05684|H01L2224/05684]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L25/0657|H01L25/0657]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2224/80379|H01L2224/80379]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
* [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}): 1 patents
* [[:Category:CPC_H01L21/76898|H01L21/76898]] ({formed through a semiconductor substrate}): 1 patents
* [[:Category:CPC_H01L23/5384|H01L23/5384]] ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors  (): 1 patents
* [[:Category:CPC_H01L24/97|H01L24/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L25/0652|H01L25/0652]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L23/5386|H01L23/5386]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 1 patents
* [[:Category:CPC_H01L2224/97|H01L2224/97]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L24/95|H01L24/95]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/01029|H01L2924/01029]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L2924/014|H01L2924/014]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
* [[:Category:CPC_H01L21/78|H01L21/78]] (with subsequent division of the substrate into plural individual devices  (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
* [[:Category:CPC_H01L23/3107|H01L23/3107]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents


=== Companies ===
=== Companies ===
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==== List of Companies ====
==== List of Companies ====
* ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 3 patents
* ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 3 patents
* Adeia Semiconductor Bonding Technologies Inc.: 1 patents


=== Collaborators ===
=== Collaborators ===
* [[:Category:Belgacem Haba of Saratoga CA (US)|Belgacem Haba of Saratoga CA (US)]][[Category:Belgacem Haba of Saratoga CA (US)]] (2 collaborations)
* [[:Category:Laura Wills Mirkarimi of Sunol CA (US)|Laura Wills Mirkarimi of Sunol CA (US)]][[Category:Laura Wills Mirkarimi of Sunol CA (US)]] (3 collaborations)
* [[:Category:Jeremy Alfred Theil of Mountain View CA (US)|Jeremy Alfred Theil of Mountain View CA (US)]][[Category:Jeremy Alfred Theil of Mountain View CA (US)]] (2 collaborations)
* [[:Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]][[Category:Cyprian Emeka Uzoh of San Jose CA (US)]] (2 collaborations)
* [[:Category:Cyprian Emeka Uzoh of San Jose CA (US)|Cyprian Emeka Uzoh of San Jose CA (US)]][[Category:Cyprian Emeka Uzoh of San Jose CA (US)]] (2 collaborations)
* [[:Category:Laura Mirkarimi of Sunol CA (US)|Laura Mirkarimi of Sunol CA (US)]][[Category:Laura Mirkarimi of Sunol CA (US)]] (1 collaborations)
* [[:Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)|Gaius Gillman Fountain, JR. of Youngsville NC (US)]][[Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)]] (2 collaborations)
* [[:Category:Chandrasekhar Mandalapu of Morrisville NC (US)|Chandrasekhar Mandalapu of Morrisville NC (US)]][[Category:Chandrasekhar Mandalapu of Morrisville NC (US)]] (1 collaborations)
* [[:Category:Jeremy Alfred Theil of Mountain View CA (US)|Jeremy Alfred Theil of Mountain View CA (US)]][[Category:Jeremy Alfred Theil of Mountain View CA (US)]] (1 collaborations)
* [[:Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)|Gaius Gillman Fountain, JR. of Youngsville NC (US)]][[Category:Gaius Gillman Fountain, JR. of Youngsville NC (US)]] (1 collaborations)
* [[:Category:Belgacem Haba of Saratoga CA (US)|Belgacem Haba of Saratoga CA (US)]][[Category:Belgacem Haba of Saratoga CA (US)]] (1 collaborations)
* [[:Category:Rajesh Katkar of Milpitas CA (US)|Rajesh Katkar of Milpitas CA (US)]][[Category:Rajesh Katkar of Milpitas CA (US)]] (1 collaborations)
* [[:Category:Thomas Workman of San Jose CA (US)|Thomas Workman of San Jose CA (US)]][[Category:Thomas Workman of San Jose CA (US)]] (1 collaborations)
* [[:Category:Pawel Mrozek of San Jose CA (US)|Pawel Mrozek of San Jose CA (US)]][[Category:Pawel Mrozek of San Jose CA (US)]] (1 collaborations)
* [[:Category:Ron Zhang of Sunnyvale CA (US)|Ron Zhang of Sunnyvale CA (US)]][[Category:Ron Zhang of Sunnyvale CA (US)]] (1 collaborations)


[[Category:Guilian Gao of Campbell CA (US)]]
[[Category:Guilian Gao of Campbell CA (US)]]
[[Category:Inventors]]
[[Category:Inventors]]
[[Category:Inventors filing patents with Adeia Semiconductor Bonding Technologies Inc.]]
[[Category:Inventors filing patents with ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.]]
[[Category:Inventors filing patents with ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.]]

Latest revision as of 11:02, 31 March 2025

Guilian Gao of Campbell CA (US)

Executive Summary

Guilian Gao of Campbell CA (US) is an inventor who has filed 3 patents. Their primary areas of innovation include {Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected} (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (3 patents), and they have worked with companies such as ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. (3 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Guilian Gao of Campbell CA (US) Monthly Patent Applications.png

Technology Areas

File:Guilian Gao of Campbell CA (US) Top Technology Areas.png

List of Technology Areas

  • H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 3 patents
  • H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
  • H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
  • H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/0219 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/03011 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05618 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
  • H01L21/76898 ({formed through a semiconductor substrate}): 1 patents
  • H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/01029 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L2924/014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
  • H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
  • H01L23/3107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Guilian Gao of Campbell CA (US) Top Companies.png

List of Companies

  • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.: 3 patents

Collaborators

Subcategories

This category has the following 8 subcategories, out of 8 total.

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