Category:Chen-Hua Yu: Difference between revisions

Revision as of 01:37, 19 July 2024

Chen-Hua Yu

Executive Summary

Chen-Hua Yu is an inventor who has filed 43 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Multilayer substrates (multilayer metallisation on monolayer substrate (8 patents), Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (8 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (43 patents). Their most frequent collaborators include (9 collaborations), (8 collaborations), (6 collaborations).

Patent Filing Activity

File:Chen-Hua Yu Monthly Patent Applications.png

Technology Areas

File:Chen-Hua Yu Top Technology Areas.png

List of Technology Areas

H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 8 patents
H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 8 patents
H01L23/49816 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 8 patents
H01L24/32 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 8 patents
H01L21/56 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
H01L23/49833 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 7 patents
H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
H01L25/0657 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 7 patents
H01L23/5389 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 6 patents
H01L23/3128 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 6 patents
H01L23/5383 ({Multilayer substrates (): 6 patents
H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 6 patents
H01L21/4857 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 6 patents
H01L24/17 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L24/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L25/105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L2224/73204 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L2225/1058 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L25/50 ({Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group): 5 patents
H01L21/4853 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 5 patents
H01L24/80 ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 5 patents
H01L2224/80895 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
H01L24/81 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L21/561 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L21/76898 ({formed through a semiconductor substrate}): 4 patents
H01L25/0652 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
G02B6/13 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 4 patents
H01L23/3121 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
G02B6/12004 (of the integrated circuit kind (electric integrated circuits): 4 patents
H01L24/09 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L21/565 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L2224/32225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L2224/80896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L24/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
H01L23/3114 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L21/563 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 3 patents
H01L24/94 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/96 ({the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting}): 3 patents
H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2225/1041 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/182 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
G02B2006/12121 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 3 patents
G02B6/4214 (Coupling light guides with opto-electronic elements): 3 patents
H01L23/49827 ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables (): 3 patents
H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 3 patents
H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/32245 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L25/0655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2224/0231 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/03 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/05 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/14 ({of a plurality of bump connectors}): 3 patents
H01L24/13 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L21/76802 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 3 patents
H01L23/31 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L24/29 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L23/5385 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 3 patents
H01L24/20 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2225/1035 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/32145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2225/1023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
G02B6/1225 (of the integrated circuit kind (electric integrated circuits): 2 patents
H01L23/3677 (Cooling facilitated by shape of device {(): 2 patents
H01L24/33 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/33181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/73253 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L23/473 (by flowing liquids {(): 2 patents
H01L23/3135 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
G02B6/4239 (Coupling light guides with opto-electronic elements): 2 patents
G02B2006/12104 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
G02B6/136 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/02373 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/1433 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L24/06 ({of a plurality of bonding areas}): 2 patents
G02B6/132 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
G02B2006/12061 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 2 patents
H01L2224/02375 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L24/83 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/1632 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L23/5384 ({Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors (): 2 patents
H01L23/562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L23/49811 ({Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads (): 2 patents
H01L2224/214 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L25/167 (the devices being of types provided for in two or more different main groups of groups): 2 patents
H01L23/3675 (Cooling facilitated by shape of device {(): 2 patents
H01L23/49861 ({Lead-frames fixed on or encapsulated in insulating substrates (): 2 patents
H01L23/528 ({Geometry or} layout of the interconnection structure {(): 2 patents
H01L23/4006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/08145 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/2919 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2924/1437 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/04105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/12105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/73267 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
H01L2224/175 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/81224 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/16148 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/48229 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/95001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06513 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06524 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/37001 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G02B6/122 (of the integrated circuit kind (electric integrated circuits): 1 patents
G02B6/12019 (of the integrated circuit kind (electric integrated circuits): 1 patents
G02B6/4243 (Coupling light guides with opto-electronic elements): 1 patents
H01L21/6835 ({using temporarily an auxiliary support}): 1 patents
H01L23/147 ({Semiconductor insulating substrates (semiconductor conductive substrates): 1 patents
H01S5/02315 (Support members, e.g. bases or carriers): 1 patents
H01S5/0232 (Lead-frames): 1 patents
H01S5/02345 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
H01S5/028 (DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL): 1 patents
H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/3736 ({Metallic materials (): 1 patents
H01L2224/29124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29166 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29172 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G02B6/262 (Optical coupling means (): 1 patents
G02B2006/12102 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
G02B6/30 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
H01L23/3171 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
H01L23/525 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/293 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/3192 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/5225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/5329 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
H01L24/11 ({Manufacturing methods (for bumps on insulating substrates): 1 patents
H01L23/5286 ({Geometry or} layout of the interconnection structure {(): 1 patents
G02B6/4295 (Coupling light guides with opto-electronic elements): 1 patents
H01L2224/02381 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/4878 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L23/315 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/83359 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2021/60022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/49866 ({characterised by the materials (materials of the substrates): 1 patents
H01L23/49894 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/14 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8234 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/35 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/0401 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/211 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/2101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/2902 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/14104 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8134 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H04B10/50 (Transmitters): 1 patents
H01L2224/08225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/4882 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L23/44 (the complete device being wholly immersed in a fluid other than air {(): 1 patents
H01L23/3735 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/16196 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/16235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/16587 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/29187 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/82896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/02379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/544 (Marks applied to semiconductor devices {or parts}, e.g. registration marks, {alignment structures, wafer maps (test patterns for characterising or monitoring manufacturing processes): 1 patents
H01L21/76895 (Applying interconnections to be used for carrying current between separate components within a device {comprising conductors and dielectrics}): 1 patents
H01L21/77 (Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate (electrically programmable read-only memories or multistep manufacturing processes therefor): 1 patents
H01L2224/02311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/02313 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/0239 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L23/5381 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
H01L21/486 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L2224/16146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/16165 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/818 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/1434 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G02B6/43 (Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections): 1 patents
G02B6/4204 (Coupling light guides with opto-electronic elements): 1 patents
G02B6/4253 (Coupling light guides with opto-electronic elements): 1 patents
G02B2006/12123 (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 1 patents
H01L2224/05022 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05562 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05571 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05624 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05647 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05666 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/05684 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/08147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/08237 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13109 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13111 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13116 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13124 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13139 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13144 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13147 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13155 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/13164 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80357 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80379 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/0504 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/0544 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/05494 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/0665 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/07025 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/1432 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/14361 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
G02B6/0006 (Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings): 1 patents
G02B6/124 (of the integrated circuit kind (electric integrated circuits): 1 patents
G02B6/4244 (Coupling light guides with opto-electronic elements): 1 patents
G02B6/4283 (Coupling light guides with opto-electronic elements): 1 patents
H01L23/367 (Cooling facilitated by shape of device {(): 1 patents
H01L23/4012 ({for stacked arrangements of a plurality of semiconductor devices (assemblies per se): 1 patents
H01L23/50 (for integrated circuit devices, {e.g. power bus, number of leads} (): 1 patents
H01L2224/04042 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/48227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/73265 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/81385 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/00014 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/14 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/15311 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/181 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/481 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L24/92 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/08146 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/33505 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/33519 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/80006 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8083 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/83005 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/8383 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/83896 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/92142 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06541 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/06589 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/023 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2225/107 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/568 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
H01L2224/19 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/83101 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/92244 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2224/97 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L2924/18162 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
H01L21/4871 (Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups): 1 patents
H01L21/78 (with subsequent division of the substrate into plural individual devices (cutting to change the surface-physical characteristics or shape of semiconductor bodies): 1 patents
H01L22/12 ({for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions (electrical measurement of diffusions): 1 patents
H01L2924/19103 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Chen-Hua Yu Top Companies.png

List of Companies

Taiwan Semiconductor Manufacturing Co., Ltd.: 43 patents

Collaborators

Jiun Yi Wu (9 collaborations)
Hsing-Kuo Hsia (8 collaborations)
Chung-Shi Liu (6 collaborations)
Jui Lin Chao (6 collaborations)
Szu-Wei Lu (5 collaborations)
Chuei-Tang Wang (5 collaborations)
Chung-Hao Tsai (4 collaborations)
Wei-Yu Chen (3 collaborations)
Shang-Yun Hou (3 collaborations)
Chih-Wei Tseng (3 collaborations)
Ming-Fa Chen (3 collaborations)
Hung-Yi Kuo (3 collaborations)
Hao-Yi Tsai (3 collaborations)
Tin-Hao Kuo (3 collaborations)
Tung-Liang Shao (3 collaborations)
Yu-Sheng Huang (3 collaborations)
Chi-Hsi Wu (2 collaborations)
Hsien-Pin Hu (2 collaborations)
Jing-Cheng Lin (2 collaborations)
Yung-Chi Lin (2 collaborations)
Kuo-Chung Yee (2 collaborations)
Chung-Ju Lee (2 collaborations)
Cheng-Chieh Hsieh (2 collaborations)
An-Jhih Su (2 collaborations)
Chao-Wen Shih (2 collaborations)
Chien-Hsun Lee (2 collaborations)
Hsien-Wei Chen (2 collaborations)
Jie Chen (2 collaborations)
Wen-Chih Chiou (2 collaborations)
Chia-Shen Cheng (1 collaborations)
Hao-Jan Pei (1 collaborations)
Philip Yu-Shuan Chung (1 collaborations)
Kuei-Wei Huang (1 collaborations)
Yu-Peng Tsai (1 collaborations)
Hsiu-Jen Lin (1 collaborations)
Ching-Hua Hsieh (1 collaborations)
Chin-Chuan Chang (1 collaborations)
Chih-Hao Yu (1 collaborations)
Shih-Peng Tai (1 collaborations)
Kuo-Chiang Ting (1 collaborations)
Sung-Hui Huang (1 collaborations)
Jiun Ren Lai (1 collaborations)
Yu-Jen Lien (1 collaborations)
Ke-Han Shen (1 collaborations)
Wei-Kong Sheng (1 collaborations)
Tsung-Fu Tsai (1 collaborations)
Chih-Ming Ke (1 collaborations)
Han-Ping Pu (1 collaborations)
Hsin-Yu Pan (1 collaborations)
Sen-Kuei Hsu (1 collaborations)
Chih-Hsin Lu (1 collaborations)
Chin-Her Chien (1 collaborations)
You-Rong Shaw (1 collaborations)
Chia-Chia Lin (1 collaborations)
Kuo Yang Wu (1 collaborations)
Po-Hao Tsai (1 collaborations)
Wei Ling Chang (1 collaborations)
Che-Wei Hsu (1 collaborations)
Wen-Hao Cheng (1 collaborations)
Chieh-Yen Chen (1 collaborations)
Jeng-Nan Hung (1 collaborations)
Chih-Hang Tung (1 collaborations)
Chung-Ming Weng (1 collaborations)
Tsung-Yuan Yu (1 collaborations)
Hua-Kuei Lin (1 collaborations)
Che-Hsiang Hsu (1 collaborations)
Wei-Kang Hsieh (1 collaborations)
Shih-Wei Chen (1 collaborations)
Yih Wang (1 collaborations)
Wei-Ting Chen (1 collaborations)
Shin-Puu Jeng (1 collaborations)
Der-Chyang Yeh (1 collaborations)
Sao-Ling Chiu (1 collaborations)
Wen-Hsin Wei (1 collaborations)
Ping-Kang Huang (1 collaborations)
Chih-Ta Shen (1 collaborations)
Ying-Ching Shih (1 collaborations)
Tzuan-Horng Liu (1 collaborations)
Sung-Feng Yeh (1 collaborations)

Subcategories

This category has the following 11 subcategories, out of 11 total.

C

► Chen-Hua Yu‎ (11 C)
► Ching-Hua Hsieh‎ (5 C)
► Chung-Shi Liu‎ (10 C)

H

► Hao-Jan Pei‎ (4 C)
► Hao-Yi Tsai‎ (4 C)
► Hsing-Kuo Hsia‎ (2 C)
► Hsiu-Jen Lin‎ (7 C)

J

► Jiun Yi Wu‎ (3 C)

K

► Kuo-Chung Yee‎ (3 C)

S

► Szu-Wei Lu‎ (5 C)

W

► Wei-Yu Chen‎ (7 C)

@@ Line 2: / Line 2: @@
 === Executive Summary ===
-Chen-Hua Yu is an inventor who has filed 45 patents. Their primary areas of innovation include Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (9 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Multilayer substrates  (multilayer metallisation on monolayer substrate (8 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (43 patents), Taiwan Semiconductor Manufacturing Co., Ltd (2 patents). Their most frequent collaborators include [[Category:Jiun Yi Wu|Jiun Yi Wu]] (9 collaborations), [[Category:Hsing-Kuo Hsia|Hsing-Kuo Hsia]] (8 collaborations), [[Category:Chung-Shi Liu|Chung-Shi Liu]] (6 collaborations).
+Chen-Hua Yu is an inventor who has filed 43 patents. Their primary areas of innovation include SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (9 patents), {Multilayer substrates  (multilayer metallisation on monolayer substrate (8 patents), Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor} (8 patents), and they have worked with companies such as Taiwan Semiconductor Manufacturing Co., Ltd. (43 patents). Their most frequent collaborators include [[Category:Jiun Yi Wu|Jiun Yi Wu]] (9 collaborations), [[Category:Hsing-Kuo Hsia|Hsing-Kuo Hsia]] (8 collaborations), [[Category:Chung-Shi Liu|Chung-Shi Liu]] (6 collaborations).
 === Patent Filing Activity ===
@@ Line 11: / Line 11: @@
 ==== List of Technology Areas ====
-* [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 9 patents
 * [[:Category:CPC_H01L24/16|H01L24/16]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 9 patents
 * [[:Category:CPC_H01L23/49822|H01L23/49822]] ({Multilayer substrates  (multilayer metallisation on monolayer substrate): 8 patents
+* [[:Category:CPC_H01L23/481|H01L23/481]] (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 8 patents
 * [[:Category:CPC_H01L23/49816|H01L23/49816]] (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers  (shape of the substrate): 8 patents
 * [[:Category:CPC_H01L24/32|H01L24/32]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 8 patents
@@ Line 36: / Line 36: @@
 * [[:Category:CPC_H01L24/80|H01L24/80]] ({Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected}): 5 patents
 * [[:Category:CPC_H01L2224/80895|H01L2224/80895]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
-* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 5 patents
 * [[:Category:CPC_H01L24/81|H01L24/81]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
 * [[:Category:CPC_H01L21/561|H01L21/561]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
@@ Line 45: / Line 44: @@
 * [[:Category:CPC_G02B6/12004|G02B6/12004]] (of the integrated circuit kind  (electric integrated circuits): 4 patents
 * [[:Category:CPC_H01L24/09|H01L24/09]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
-* [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
-* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
 * [[:Category:CPC_H01L21/565|H01L21/565]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
 * [[:Category:CPC_H01L2224/32225|H01L2224/32225]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
 * [[:Category:CPC_H01L2224/80896|H01L2224/80896]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
-* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
+* [[:Category:CPC_H01L24/19|H01L24/19]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 4 patents
 * [[:Category:CPC_H01L23/3114|H01L23/3114]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 * [[:Category:CPC_H01L21/563|H01L21/563]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
@@ Line 61: / Line 58: @@
 * [[:Category:CPC_G02B2006/12121|G02B2006/12121]] (OPTICAL ELEMENTS, SYSTEMS OR APPARATUS): 3 patents
 * [[:Category:CPC_G02B6/4214|G02B6/4214]] (Coupling light guides with opto-electronic elements): 3 patents
-* [[:Category:CPC_H01L23/3675|H01L23/3675]] (Cooling facilitated by shape of device {(): 3 patents
 * [[:Category:CPC_H01L23/49827|H01L23/49827]] ({Via connections through the substrates, e.g. pins going through the substrate, coaxial cables  (): 3 patents
 * [[:Category:CPC_H10B80/00|H10B80/00]] (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 3 patents
@@ Line 68: / Line 64: @@
 * [[:Category:CPC_H01L25/0655|H01L25/0655]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 * [[:Category:CPC_H01L2224/0231|H01L2224/0231]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L24/03|H01L24/03]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
+* [[:Category:CPC_H01L24/05|H01L24/05]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 * [[:Category:CPC_H01L24/14|H01L24/14]] ({of a plurality of bump connectors}): 3 patents
 * [[:Category:CPC_H01L24/13|H01L24/13]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
@@ Line 75: / Line 73: @@
 * [[:Category:CPC_H01L2924/1431|H01L2924/1431]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 * [[:Category:CPC_H01L23/5385|H01L23/5385]] (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates  ({): 3 patents
+* [[:Category:CPC_H01L24/20|H01L24/20]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 * [[:Category:CPC_H01L2225/1035|H01L2225/1035]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 3 patents
 * [[:Category:CPC_H01L2924/3511|H01L2924/3511]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
@@ Line 104: / Line 103: @@
 * [[:Category:CPC_H01L2224/214|H01L2224/214]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 2 patents
 * [[:Category:CPC_H01L25/167|H01L25/167]] (the devices being of types provided for in two or more different main groups of groups): 2 patents
+* [[:Category:CPC_H01L23/3675|H01L23/3675]] (Cooling facilitated by shape of device {(): 2 patents
 * [[:Category:CPC_H01L23/49861|H01L23/49861]] ({Lead-frames fixed on or encapsulated in insulating substrates  (): 2 patents
 * [[:Category:CPC_H01L23/528|H01L23/528]] ({Geometry or} layout of the interconnection structure {(): 2 patents
@@ Line 125: / Line 125: @@
 * [[:Category:CPC_G02B6/12019|G02B6/12019]] (of the integrated circuit kind  (electric integrated circuits): 1 patents
 * [[:Category:CPC_G02B6/4243|G02B6/4243]] (Coupling light guides with opto-electronic elements): 1 patents
-* [[:Category:CPC_H01L23/433|H01L23/433]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
-* [[:Category:CPC_H05K7/20218|H05K7/20218]] (Modifications to facilitate cooling, ventilating, or heating): 1 patents
 * [[:Category:CPC_H01L21/6835|H01L21/6835]] ({using temporarily an auxiliary support}): 1 patents
 * [[:Category:CPC_H01L23/147|H01L23/147]] ({Semiconductor insulating substrates  (semiconductor conductive substrates): 1 patents
@@ Line 233: / Line 231: @@
 * [[:Category:CPC_H01L23/367|H01L23/367]] (Cooling facilitated by shape of device {(): 1 patents
 * [[:Category:CPC_H01L23/4012|H01L23/4012]] ({for stacked arrangements of a plurality of semiconductor devices  (assemblies per se): 1 patents
-* [[:Category:CPC_H01L24/82|H01L24/82]] ({by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]  (interconnection structure between a plurality of semiconductor chips): 1 patents
-* [[:Category:CPC_H01L2224/05009|H01L2224/05009]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
 * [[:Category:CPC_H01L23/50|H01L23/50]] (for integrated circuit devices, {e.g. power bus, number of leads} (): 1 patents
 * [[:Category:CPC_H01L2224/04042|H01L2224/04042]] (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
@@ Line 277: / Line 273: @@
 ==== List of Companies ====
 * Taiwan Semiconductor Manufacturing Co., Ltd.: 43 patents
-* Taiwan Semiconductor Manufacturing Co., Ltd: 2 patents
 === Collaborators ===
@@ Line 286: / Line 281: @@
 * [[:Category:Szu-Wei Lu|Szu-Wei Lu]][[Category:Szu-Wei Lu]] (5 collaborations)
 * [[:Category:Chuei-Tang Wang|Chuei-Tang Wang]][[Category:Chuei-Tang Wang]] (5 collaborations)
-* [[:Category:Tung-Liang Shao|Tung-Liang Shao]][[Category:Tung-Liang Shao]] (4 collaborations)
-* [[:Category:Yu-Sheng Huang|Yu-Sheng Huang]][[Category:Yu-Sheng Huang]] (4 collaborations)
-* [[:Category:Hung-Yi Kuo|Hung-Yi Kuo]][[Category:Hung-Yi Kuo]] (4 collaborations)
 * [[:Category:Chung-Hao Tsai|Chung-Hao Tsai]][[Category:Chung-Hao Tsai]] (4 collaborations)
 * [[:Category:Wei-Yu Chen|Wei-Yu Chen]][[Category:Wei-Yu Chen]] (3 collaborations)
@@ Line 294: / Line 286: @@
 * [[:Category:Chih-Wei Tseng|Chih-Wei Tseng]][[Category:Chih-Wei Tseng]] (3 collaborations)
 * [[:Category:Ming-Fa Chen|Ming-Fa Chen]][[Category:Ming-Fa Chen]] (3 collaborations)
-* [[:Category:Kuo-Chung Yee|Kuo-Chung Yee]][[Category:Kuo-Chung Yee]] (3 collaborations)
+* [[:Category:Hung-Yi Kuo|Hung-Yi Kuo]][[Category:Hung-Yi Kuo]] (3 collaborations)
 * [[:Category:Hao-Yi Tsai|Hao-Yi Tsai]][[Category:Hao-Yi Tsai]] (3 collaborations)
 * [[:Category:Tin-Hao Kuo|Tin-Hao Kuo]][[Category:Tin-Hao Kuo]] (3 collaborations)
+* [[:Category:Tung-Liang Shao|Tung-Liang Shao]][[Category:Tung-Liang Shao]] (3 collaborations)
+* [[:Category:Yu-Sheng Huang|Yu-Sheng Huang]][[Category:Yu-Sheng Huang]] (3 collaborations)
 * [[:Category:Chi-Hsi Wu|Chi-Hsi Wu]][[Category:Chi-Hsi Wu]] (2 collaborations)
 * [[:Category:Hsien-Pin Hu|Hsien-Pin Hu]][[Category:Hsien-Pin Hu]] (2 collaborations)
 * [[:Category:Jing-Cheng Lin|Jing-Cheng Lin]][[Category:Jing-Cheng Lin]] (2 collaborations)
 * [[:Category:Yung-Chi Lin|Yung-Chi Lin]][[Category:Yung-Chi Lin]] (2 collaborations)
+* [[:Category:Kuo-Chung Yee|Kuo-Chung Yee]][[Category:Kuo-Chung Yee]] (2 collaborations)
 * [[:Category:Chung-Ju Lee|Chung-Ju Lee]][[Category:Chung-Ju Lee]] (2 collaborations)
 * [[:Category:Cheng-Chieh Hsieh|Cheng-Chieh Hsieh]][[Category:Cheng-Chieh Hsieh]] (2 collaborations)
@@ Line 363: / Line 358: @@
 [[Category:Inventors]]
 [[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Co., Ltd.]]
-[[Category:Inventors filing patents with Taiwan Semiconductor Manufacturing Co., Ltd]]