Category:Chun-Yen TING

Chun-Yen TING

Executive Summary

Chun-Yen TING is an inventor who has filed 3 patents. Their primary areas of innovation include {Multilayer substrates (multilayer metallisation on monolayer substrate (1 patents), Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as Advanced Semiconductor Engineering, Inc. (3 patents). Their most frequent collaborators include (3 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

File:Chun-Yen TING Monthly Patent Applications.png

Technology Areas

File:Chun-Yen TING Top Technology Areas.png

List of Technology Areas

• H01L23/49822 ({Multilayer substrates (multilayer metallisation on monolayer substrate): 1 patents
• H01L23/49838 (Leads, {i.e. metallisations or lead-frames} on insulating substrates, {e.g. chip carriers (shape of the substrate): 1 patents
• H01L24/08 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/08235 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/1431 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2924/3511 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L23/481 (Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements {; Selection of materials therefor}): 1 patents
• H01L23/552 (Protection against radiation, e.g. light {or electromagnetic waves}): 1 patents
• H05K1/0231 ({using auxiliary mounted passive components or auxiliary substances (printed passive components): 1 patents
• H01L25/18 (the devices being of types provided for in two or more different subgroups of the same main group of groups): 1 patents
• H10B80/00 (Assemblies of multiple devices comprising at least one memory device covered by this subclass): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/48 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L24/73 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48091 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48105 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/48225 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/73257 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Advanced Semiconductor Engineering, Inc.: 3 patents

Collaborators

• Hung-Chun KUO (3 collaborations)
• Jung Jui KANG (3 collaborations)
• Chiung-Ying KUO (2 collaborations)
• Chang Chi LEE (2 collaborations)