Category:Hujun ZHANG

Hujun ZHANG

Executive Summary

Hujun ZHANG is an inventor who has filed 1 patents. Their primary areas of innovation include {Multilayer substrates ( (1 patents), the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as CHENGDU BRIGHT POWER SEMICONDUCTOR CO., LTD. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Hujun ZHANG Monthly Patent Applications.png

Technology Areas

File:Hujun ZHANG Top Technology Areas.png

List of Technology Areas

• H01L23/5383 ({Multilayer substrates (): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Hujun ZHANG Top Companies.png

List of Companies

• CHENGDU BRIGHT POWER SEMICONDUCTOR CO., LTD.: 1 patents

Collaborators

• Tiecheng ZHANG (1 collaborations)
• Dong LI (1 collaborations)
• Qian OUYANG (1 collaborations)