Category:Qian OUYANG

Qian OUYANG

Executive Summary

Qian OUYANG is an inventor who has filed 1 patents. Their primary areas of innovation include {Multilayer substrates ( (1 patents), the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as CHENGDU BRIGHT POWER SEMICONDUCTOR CO., LTD. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Qian OUYANG Monthly Patent Applications.png

Technology Areas

File:Qian OUYANG Top Technology Areas.png

List of Technology Areas

• H01L23/5383 ({Multilayer substrates (): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• CHENGDU BRIGHT POWER SEMICONDUCTOR CO., LTD.: 1 patents

Collaborators

• Tiecheng ZHANG (1 collaborations)
• Hujun ZHANG (1 collaborations)
• Dong LI (1 collaborations)