Category:Tiecheng ZHANG

Tiecheng ZHANG

Executive Summary

Tiecheng ZHANG is an inventor who has filed 1 patents. Their primary areas of innovation include {Multilayer substrates ( (1 patents), the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({ (1 patents), SEMICONDUCTOR DEVICES NOT COVERED BY CLASS (1 patents), and they have worked with companies such as CHENGDU BRIGHT POWER SEMICONDUCTOR CO., LTD. (1 patents). Their most frequent collaborators include (1 collaborations), (1 collaborations), (1 collaborations).

Patent Filing Activity

File:Tiecheng ZHANG Monthly Patent Applications.png

Technology Areas

File:Tiecheng ZHANG Top Technology Areas.png

List of Technology Areas

• H01L23/5383 ({Multilayer substrates (): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/16 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L2224/16227 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

File:Tiecheng ZHANG Top Companies.png

List of Companies

• CHENGDU BRIGHT POWER SEMICONDUCTOR CO., LTD.: 1 patents

Collaborators

• Hujun ZHANG (1 collaborations)
• Dong LI (1 collaborations)
• Qian OUYANG (1 collaborations)