Category:Indra V. Chary of Boise ID (US)

Indra V. Chary of Boise ID (US)

Executive Summary

Indra V. Chary of Boise ID (US) is an inventor who has filed 4 patents. Their primary areas of innovation include ELECTRONIC MEMORY DEVICES (4 patents), ELECTRONIC MEMORY DEVICES (4 patents), ELECTRONIC MEMORY DEVICES (2 patents), and they have worked with companies such as Lodestar Licensing Group LLC (4 patents). Their most frequent collaborators include (4 collaborations), (3 collaborations), (2 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H10B41/27 (ELECTRONIC MEMORY DEVICES): 4 patents
• H10B43/27 (ELECTRONIC MEMORY DEVICES): 4 patents
• H10B41/41 (ELECTRONIC MEMORY DEVICES): 2 patents
• G11C5/063 (STATIC STORES (semiconductor memory devices): 2 patents
• H10B41/35 (ELECTRONIC MEMORY DEVICES): 2 patents
• H10B43/35 (ELECTRONIC MEMORY DEVICES): 2 patents
• H10B43/40 (ELECTRONIC MEMORY DEVICES): 2 patents
• G11C5/025 ({Geometric lay-out considerations of storage- and peripheral-blocks in a semiconductor storage device (geometrical lay-out of the components in integrated circuits,): 1 patents
• G11C5/06 (STATIC STORES (semiconductor memory devices): 1 patents
• H01L21/76838 ({characterised by the formation and the after-treatment of the conductors (etching for patterning the conductors): 1 patents
• H01L23/5386 (the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates ({): 1 patents
• H01L24/14 ({of a plurality of bump connectors}): 1 patents
• H01L23/5283 ({Geometry or} layout of the interconnection structure {(): 1 patents
• H01L21/31144 ({using masks}): 1 patents
• H01L21/76804 ({by forming tapered via holes}): 1 patents
• H01L21/76877 ({Thin films associated with contacts of capacitors}): 1 patents
• H01L23/5226 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents

Companies

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List of Companies

• Lodestar Licensing Group LLC: 4 patents

Collaborators

• Shuangqiang Luo of Boise ID (US) (4 collaborations)
• Justin B. Dorhout of Boise ID (US) (3 collaborations)
• Rita J. Klein of Boise ID (US) (2 collaborations)