Category:David French of Fort Myers FL (US)

David French of Fort Myers FL (US)

Executive Summary

David French of Fort Myers FL (US) is an inventor who has filed 6 patents. Their primary areas of innovation include Gas-filled discharge tubes (heating by discharge (3 patents), ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps (3 patents), {Matching circuits} (3 patents), and they have worked with companies such as Lam Research Corporation (6 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01J37/32174 (Gas-filled discharge tubes (heating by discharge): 3 patents
• H01J2237/3321 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 3 patents
• H01J37/32183 ({Matching circuits}): 3 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 3 patents
• H01J37/32146 (Gas-filled discharge tubes (heating by discharge): 2 patents
• C23C16/517 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 2 patents
• C23C16/52 (Controlling or regulating the coating process {(): 2 patents
• H01L21/0272 (Making masks on semiconductor bodies for further photolithographic processing not provided for in group): 2 patents
• H01L21/31144 ({using masks}): 2 patents
• H01L21/32139 ({using masks}): 2 patents
• G01R19/2509 (using digital measurement techniques): 2 patents
• G01R15/16 (using capacitive devices): 2 patents
• H01L21/67161 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 2 patents
• H01J37/32935 (Gas-filled discharge tubes (heating by discharge): 2 patents
• G01R15/18 (using inductive devices, e.g. transformers): 1 patents
• H01J37/32899 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J2237/24495 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
• H01J2237/24564 (Measurements of electric or magnetic variables, e.g. voltage, current, frequency): 1 patents
• G01R15/183 (using inductive devices, e.g. transformers): 1 patents
• G01R19/16528 (Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values): 1 patents
• G01R25/00 (Arrangements for measuring phase angle between a voltage and a current or between voltages or currents): 1 patents
• G01R35/007 ({Standards or reference devices, e.g. voltage or resistance standards, "golden references"}): 1 patents
• H01J37/32926 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/3244 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32642 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67288 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67259 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67207 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67069 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67167 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/68771 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01J37/32385 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32577 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67201 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01J37/32715 (Gas-filled discharge tubes (heating by discharge): 1 patents

Companies

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List of Companies

• Lam Research Corporation: 6 patents

Collaborators

• Sunil Kapoor of Vancouver WA (US) (3 collaborations)
• Matthew Scott Weimer of Portland OR (US) (2 collaborations)
• Pramod Subramonium of Portland OR (US) (2 collaborations)
• Ragesh Puthenkovilakam of Portland OR (US) (2 collaborations)
• Rujun Bai of King City OR (US) (2 collaborations)
• Gary Lemson of San Jose CA (US) (1 collaborations)
• Liang Meng of Sherwood OR (US) (1 collaborations)
• Sam Jafarian Tehrani of Fremont CA (US) (1 collaborations)
• Karl Frederick Leeser of West Linn OR (US) (1 collaborations)
• John Michael Wiltse of Lake Oswego OR (US) (1 collaborations)
• Edward Augustyniak of Tualatin OR (US) (1 collaborations)
• Yukinori Sakiyama of West Linn OR (US) (1 collaborations)
• George Thomas of Fremont CA (US) (1 collaborations)