Category:Yukinori Sakiyama of West Linn OR (US)

Yukinori Sakiyama of West Linn OR (US)

Executive Summary

Yukinori Sakiyama of West Linn OR (US) is an inventor who has filed 4 patents. Their primary areas of innovation include Gas-filled discharge tubes (heating by discharge (2 patents), Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se (2 patents), Gas-filled discharge tubes (heating by discharge (2 patents), and they have worked with companies such as Lam Research Corporation (4 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

File:Yukinori Sakiyama of West Linn OR (US) Monthly Patent Applications.png

Technology Areas

File:Yukinori Sakiyama of West Linn OR (US) Top Technology Areas.png

List of Technology Areas

• H01J37/32972 (Gas-filled discharge tubes (heating by discharge): 2 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 2 patents
• H01J37/32944 (Gas-filled discharge tubes (heating by discharge): 2 patents
• H01J2237/3321 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 2 patents
• G06T7/0004 ({Industrial image inspection}): 1 patents
• H01J37/32926 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32981 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/3299 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67248 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01J2237/221 (Treatment of data (mixing signals): 1 patents
• H01J2237/3341 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
• H01J37/32165 (Gas-filled discharge tubes (heating by discharge): 1 patents
• G01J5/485 (Thermography; Techniques using wholly visual means): 1 patents
• C23C16/0227 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45536 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45544 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45565 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/4583 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/50 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/52 (Controlling or regulating the coating process {(): 1 patents
• G01J5/0066 (Radiation pyrometry, e.g. infrared or optical thermometry): 1 patents
• G01J5/0859 (Optical arrangements): 1 patents
• G01M3/38 (TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR): 1 patents
• G06T7/001 ({using an image reference approach}): 1 patents
• G06T7/13 (Edge detection): 1 patents
• G01J2005/0077 (MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources): 1 patents
• G06T2207/10048 (Image acquisition modality): 1 patents
• G06T2207/20084 (Special algorithmic details): 1 patents
• G06T2207/30148 (Subject of image; Context of image processing): 1 patents
• H04N23/23 (PICTORIAL COMMUNICATION, e.g. TELEVISION): 1 patents
• H01L21/67288 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67259 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67207 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67069 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67167 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01J37/32183 ({Matching circuits}): 1 patents
• H01L21/68771 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01J37/32385 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32935 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32577 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67201 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01J37/32715 (Gas-filled discharge tubes (heating by discharge): 1 patents

Companies

File:Yukinori Sakiyama of West Linn OR (US) Top Companies.png

List of Companies

• Lam Research Corporation: 4 patents

Collaborators

• Karl Frederick Leeser of West Linn OR (US) (3 collaborations)
• Michal Danek of Cupertino CA (US) (2 collaborations)
• Benjamin Allen Haskell of Pleasanton CA (US) (2 collaborations)
• Kapu Sirish Reddy of Portland OR (US) (2 collaborations)
• Paul Franzen of West Linn OR (US) (2 collaborations)
• Kapil Sawlani of Ann Arbor MI (US) (2 collaborations)
• Sunil Kapoor of Vancouver WA (US) (2 collaborations)
• David Badt of Tigard OR (US) (1 collaborations)
• Brian Joseph Williams of Tigard OR (US) (1 collaborations)
• Jennifer Leigh Petraglia of Lake Oswego OR (US) (1 collaborations)
• Noah Elliot Baker of West Linn OR (US) (1 collaborations)
• Liang Meng of Sherwood OR (US) (1 collaborations)
• Edward Augustyniak of Tualatin OR (US) (1 collaborations)
• David French of Fort Myers FL (US) (1 collaborations)
• George Thomas of Fremont CA (US) (1 collaborations)