Category:Karl Frederick Leeser of West Linn OR (US)

Karl Frederick Leeser of West Linn OR (US)

Executive Summary

Karl Frederick Leeser of West Linn OR (US) is an inventor who has filed 11 patents. Their primary areas of innovation include Gas-filled discharge tubes (heating by discharge (3 patents), Gas-filled discharge tubes (heating by discharge (2 patents), Gas-filled discharge tubes (heating by discharge (2 patents), and they have worked with companies such as Lam Research Corporation (11 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

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Technology Areas

File:Karl Frederick Leeser of West Linn OR (US) Top Technology Areas.png

List of Technology Areas

• H01J37/3244 (Gas-filled discharge tubes (heating by discharge): 3 patents
• H01J37/32972 (Gas-filled discharge tubes (heating by discharge): 2 patents
• H01J37/32944 (Gas-filled discharge tubes (heating by discharge): 2 patents
• C23C16/45565 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 2 patents
• G06T7/0004 ({Industrial image inspection}): 1 patents
• H01J37/32926 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32981 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/3299 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67248 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01J2237/221 (Treatment of data (mixing signals): 1 patents
• H01J2237/3321 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
• H01J2237/3341 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
• H01J37/32183 ({Matching circuits}): 1 patents
• H01J37/32082 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H03H7/40 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents
• H01J37/32165 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32697 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32715 (Gas-filled discharge tubes (heating by discharge): 1 patents
• G01J5/485 (Thermography; Techniques using wholly visual means): 1 patents
• C23C16/0227 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45536 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/45544 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/4583 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/50 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/52 (Controlling or regulating the coating process {(): 1 patents
• G01J5/0066 (Radiation pyrometry, e.g. infrared or optical thermometry): 1 patents
• G01J5/0859 (Optical arrangements): 1 patents
• G01M3/38 (TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR): 1 patents
• G06T7/001 ({using an image reference approach}): 1 patents
• G06T7/13 (Edge detection): 1 patents
• G01J2005/0077 (MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources): 1 patents
• G06T2207/10048 (Image acquisition modality): 1 patents
• G06T2207/20084 (Special algorithmic details): 1 patents
• G06T2207/30148 (Subject of image; Context of image processing): 1 patents
• H04N23/23 (PICTORIAL COMMUNICATION, e.g. TELEVISION): 1 patents
• H01J37/32495 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32623 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32091 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/3255 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32174 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32642 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/68 (for positioning, orientation or alignment): 1 patents
• G05B19/4099 (CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables): 1 patents
• H01L21/68742 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L21/68764 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L21/68771 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01L21/68792 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• G05B2219/45031 (CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS (systems for controlling or regulating non-electric variables): 1 patents
• H01L21/6719 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67167 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67196 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67201 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67017 ({Apparatus for fluid treatment (): 1 patents
• F16K27/003 ({Housing formed from a plurality of the same valve elements}): 1 patents

Companies

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List of Companies

• Lam Research Corporation: 11 patents

Collaborators

• Yukinori Sakiyama of West Linn OR (US) (3 collaborations)
• Michal Danek of Cupertino CA (US) (2 collaborations)
• Benjamin Allen Haskell of Pleasanton CA (US) (2 collaborations)
• Kapu Sirish Reddy of Portland OR (US) (2 collaborations)
• Paul Franzen of West Linn OR (US) (2 collaborations)
• Kapil Sawlani of Ann Arbor MI (US) (2 collaborations)
• David Badt of Tigard OR (US) (1 collaborations)
• Brian Joseph Williams of Tigard OR (US) (1 collaborations)
• Jennifer Leigh Petraglia of Lake Oswego OR (US) (1 collaborations)
• Eller Y. Juco of Tualatin OR (US) (1 collaborations)
• Thomas Lee Frederick of West Linn OR (US) (1 collaborations)
• Paul Konkola of West Linn OR (US) (1 collaborations)
• Sunil Kapoor of Vancouver WA (US) (1 collaborations)
• Noah Elliot Baker of West Linn OR (US) (1 collaborations)
• Liang Meng of Sherwood OR (US) (1 collaborations)
• John Holland of San Jose CA (US) (1 collaborations)
• Douglas KEIL of West Linn OR (US) (1 collaborations)
• Edward J. Augustyniak of Tualatin OR (US) (1 collaborations)
• Mohamed Sabri of Beaverton OR (US) (1 collaborations)
• Sam Jafarian Tehrani of Fremont CA (US) (1 collaborations)
• David French of Fort Myers FL (US) (1 collaborations)
• John Michael Wiltse of Lake Oswego OR (US) (1 collaborations)
• Brian Lewis Ratliff of Hillsboro OR (US) (1 collaborations)
• Richard M. Blank of San Jose CA (US) (1 collaborations)
• Stephen Topping of Portland OR (US) (1 collaborations)
• John Folden Stumpf of Portland OR (US) (1 collaborations)
• Damien Long of Felton CA (US) (1 collaborations)
• Norman Nakashima of Lake Oswego OR (US) (1 collaborations)
• Michael John Selep of Portland OR (US) (1 collaborations)
• Patrick G. Breiling of Tigard OR (US) (1 collaborations)
• Timothy Scott Thomas of Wilsonville OR (US) (1 collaborations)
• David William Kamp of Wilsonville OR (US) (1 collaborations)
• Sean M. Donnelly of Portland OR (US) (1 collaborations)