Category:Sunil Kapoor of Vancouver WA (US)

Sunil Kapoor of Vancouver WA (US)

Executive Summary

Sunil Kapoor of Vancouver WA (US) is an inventor who has filed 8 patents. Their primary areas of innovation include {Matching circuits} (6 patents), Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se (5 patents), Gas-filled discharge tubes (heating by discharge (3 patents), and they have worked with companies such as Lam Research Corporation (8 patents). Their most frequent collaborators include (3 collaborations), (2 collaborations), (2 collaborations).

Patent Filing Activity

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Technology Areas

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List of Technology Areas

• H01J37/32183 ({Matching circuits}): 6 patents
• H01L21/67253 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 5 patents
• H01J37/32899 (Gas-filled discharge tubes (heating by discharge): 3 patents
• G01R19/2509 (using digital measurement techniques): 2 patents
• G01R15/16 (using capacitive devices): 2 patents
• G01R15/18 (using inductive devices, e.g. transformers): 2 patents
• H01L21/67161 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 2 patents
• H01J2237/24564 (Measurements of electric or magnetic variables, e.g. voltage, current, frequency): 2 patents
• H01J37/32935 (Gas-filled discharge tubes (heating by discharge): 2 patents
• H01L21/67069 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 2 patents
• H01J2237/3321 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 2 patents
• H01J37/32155 (Gas-filled discharge tubes (heating by discharge): 2 patents
• C23C16/45536 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 2 patents
• H01J37/3299 (Gas-filled discharge tubes (heating by discharge): 2 patents
• H01J37/32944 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32165 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32972 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J2237/24495 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
• G01R15/183 (using inductive devices, e.g. transformers): 1 patents
• G01R19/16528 (Indicating that current or voltage is either above or below a predetermined value or within or outside a predetermined range of values): 1 patents
• G01R25/00 (Arrangements for measuring phase angle between a voltage and a current or between voltages or currents): 1 patents
• G01R35/007 ({Standards or reference devices, e.g. voltage or resistance standards, "golden references"}): 1 patents
• H01J37/32926 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67288 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67259 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67207 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/67167 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01L21/68771 (using mechanical means, e.g. chucks, clamps or pinches {(using elecrostatic chucks): 1 patents
• H01J37/32385 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01J37/32577 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L21/67201 (Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components {; Apparatus not specifically provided for elsewhere (processes per se): 1 patents
• H01J37/32715 (Gas-filled discharge tubes (heating by discharge): 1 patents
• C23C16/505 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• C23C16/52 (Controlling or regulating the coating process {(): 1 patents
• G01N21/9501 ({Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step): 1 patents
• G01R13/02 (for displaying measured electric variables in digital form): 1 patents
• G01R19/0084 (Arrangements for measuring currents or voltages or for indicating presence or sign thereof (): 1 patents
• G01R27/2605 ({Measuring capacitance (capacitive sensors): 1 patents
• H01J37/32091 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H01L23/642 ({Capacitive arrangements (): 1 patents
• H01J2237/327 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
• H01L21/67028 ({for cleaning followed by drying, rinsing, stripping, blasting or the like}): 1 patents
• H01L2223/6655 (SEMICONDUCTOR DEVICES NOT COVERED BY CLASS): 1 patents
• H01L22/26 ({Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement (endpoint detection arrangements in CMP apparatus): 1 patents
• C23C16/50 (COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion): 1 patents
• H01J2237/332 (ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps): 1 patents
• H03H1/0007 (Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network (constructional details of electromechanical transducers): 1 patents
• H01J37/32724 (Gas-filled discharge tubes (heating by discharge): 1 patents
• H02M1/44 (APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF (transformers): 1 patents
• H03H7/38 (IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (measuring, testing): 1 patents

Companies

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List of Companies

• Lam Research Corporation: 8 patents

Collaborators

• David French of Fort Myers FL (US) (3 collaborations)
• Liang Meng of Sherwood OR (US) (2 collaborations)
• Yukinori Sakiyama of West Linn OR (US) (2 collaborations)
• Karl Leeser of West Linn OR (US) (2 collaborations)
• Karl Frederick Leeser of West Linn OR (US) (1 collaborations)
• Noah Elliot Baker of West Linn OR (US) (1 collaborations)
• Gary Lemson of San Jose CA (US) (1 collaborations)
• Edward Augustyniak of Tualatin OR (US) (1 collaborations)
• George Thomas of Fremont CA (US) (1 collaborations)
• Thomas Frederick of West Linn OR (US) (1 collaborations)
• Thomas Lee Frederick of West Linn OR (US) (1 collaborations)
• Aaron Logan of Battle Ground WA (US) (1 collaborations)
• Hyungjoon Kim of Beaverton OR (US) (1 collaborations)
• Yaswanth Rangineni of Portland OR (US) (1 collaborations)
• Bradford J. Lyndaker of San Ramon CA (US) (1 collaborations)