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Trademark: HI-BOND

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Proof of use for HI-BOND

We do not have any records of a proof of use for HI-BOND at this moment.

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Possible trademark infringements of HI-BOND

Basic Information about HI-BOND

Serial Number
73489923
Filing Date
16 Jul 1984
Registration Number
1327996
Registration Date
02 Apr 1985
Mark Drawing Code
1

Classifications

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First use of HI-BOND anywhere
HI-BOND was first used on 24 May 1984 for the primary classification of goods and services, international, 006 (Metal goods)
First use in commerce
There is no first use of this trademark in commerce detected yet.
Status Code
2
International Code
006
US Codes
013

Correspondent

Allegretti & Witcoff
10 South Wacker Drive
Chicago, IL 60606

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