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Trademark: HY-BOND

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Proof of use for HY-BOND

We do not have any records of a proof of use for HY-BOND at this moment.

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Possible trademark infringements of HY-BOND

Basic Information about HY-BOND

Serial Number
78641278
Filing Date
01 Jun 2005
Registration Number
3095467
Registration Date
23 May 2006
Mark Drawing Code
4

Classifications

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First use of HY-BOND anywhere
HY-BOND was first used on 04 Feb 1987 for the primary classification of goods and services, international, 005 (Pharmaceuticals)
First use in commerce
There is no first use of this trademark in commerce detected yet.
Status Code
6
International Code
005
US Codes
006; 018; 044; 046; 051; 052

Who owns HY-BOND?

1. Shofu, Inc. KYOTO

2. Shofu, Inc. Kyoto 605

3. Shofu, Inc. Kyoto 605

Correspondent

Stacey R. Halpern
Knobbe Martens Olson & Bear, LLP
2040 Main Street, 14th Floor
IRVINE CA 92614-7216

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