Trademark: JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING
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Mark Identification
JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING
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Basic Information about JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING
- Serial Number
- 86788141
- Filing Date
- 14 Oct 2015
- Registration Number
- 4968766
- Registration Date
- 31 May 2016
- Mark Drawing Code
- 4
Classifications
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- First use of JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING anywhere
- JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING was first used on 19 Mar 2004 for the primary classification of goods and services, international, 009 (Electrical and scientific apparatus)
- First use in commerce
- There is no first use of this trademark in commerce detected yet.
- Status Code
- 6
- International Code
- 009
- US Codes
- 021; 023; 026; 036; 038
- First use of JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING anywhere
- JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING was first used on 19 Mar 2004 for the primary classification of goods and services, international, 016 (Paper goods and printed matter)
- First use in commerce
- There is no first use of this trademark in commerce detected yet.
- Status Code
- 6
- International Code
- 016
- US Codes
- 002; 005; 022; 023; 029; 037; 038; 050
Who owns JOURNAL OF MICROELECTRONICS AND ELECTRONIC PACKAGING?
1. International Microelectronics and Packaging Society Research Triangle Park NC
2. International Microelectronics and Packaging Society Research Triangle Park NC
3. International Microelectronics and Packaging Society Research Triangle Park NC
Correspondent
- David M. Abrahams
- Webster Chamberlain Bean
- 1747 Pennsylvania Avenue, N.W.
- Suite 1000
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